PEOPLE
Professor
Principal Investigator
Assistant Professor / May 2024 - current
Department of Electrical Engineering and Computer Science
Daegu Gyeongbuk Institute of Science and Technology (DGIST)
Address: Bldg. E3 - Rm. 312, DGIST, 333 Techno Jungang-daero, Dalseong-gun, Daegu 42988, South Korea
Call: +82-53-785-6349
Email: byeongmoon@dgist.ac.kr
Education
Aug 2020
Feb 2014
Ph.D. in Electrical and Computer Engineering, Seoul National University, South Korea
B.S. in Electrical and Computer Engineering, Seoul National University, South Korea
Professional Experience
Jan 2024 - May 2024
Jan 2023 - Jan 2024
Aug 2020 - Jan 2024
Post-Doctoral Researcher, Prof. Zhenan Bao's group, Stanford University
Visiting Post-Doctoral Researcher, Prof. Zhenan Bao's group, Stanford University
Post-Doctoral Research Fellow, Korea Institute of Science and Technology (KIST)
Members
Post-Doctoral Researchers
Post-Doctoral Researcher
Sep. 2025 - current
Flexible electronics
3D-Printed soft electrodes
Bioelectronic materials
Bldg. E3 -Rm. 603
Graduate Students
Dahyun Hong
Ph.D. Candidate
Feb. 2026 - Current
Research Interests
Flexible and Stretchable Electronics
Stretchable Electrodes
Soft Robotic Systems
Bldg. E3 - Rm. 603
Jiyoung Park
Ph.D. Candidate
Feb. 2026 - Current
Research Interests
3D-Printed Soft Electronics
Flexible Electronic Devices
Humanoid Robot Sensing
Bldg. E3 - Rm. 603
Minhu Jeon
Post-Graduate Researcher
Aug. 2026 - current
Research Interests
Heterogeneous Integration
Stretchable Circuits and Systems
Additive Manufacturing
Bldg. E3 - Rm. 603
Hyeonjin Jang
M.S. Candidate
Feb. 2025 - Current
Research Interests
Hand-Pose Estimation
Skin Electronics
AI-based Sensor Systems
Bldg. E3 -Rm. 603
Jonghun Jeong
M.S. Candidate
Feb. 2025 - Current
Research Interests
Ultraflexible and Stretchable E-Skin
Physical AI
Stretchable Electrodes
Bldg. E3 -Rm. 603
Youlim Kim
M.S. Candidate
Aug. 2025 - Current
Research Interests
Flexible & Stretchable Electronics
Thermoelectric Devices & Energy Harvesting
Wearable & Soft Electronics
Bldg. E3 -Rm. 603
Joungil Byun
M.S. Candidate
Sep. 2025 - Current
Research Interests
Conductive hydrogels
3D-printed soft materials
Bioelectronic materials
Bldg. E3 -Rm. 603
Byeongjun Jeong
M.S. Candidate
Feb. 2026 - Current
Research Interests
Stretchable and Flexible Electronics
Physical AI
Advanced Packaging Technology
Bldg. E3 -Rm. 603
Undergraduate Researchers
Seonghwan Jeon
DGIST
Feb. 2026 - Current (2026 UGRP)
Research Topic
Development of a Next-Generation HCI System Using 3D-Printed Skin-Integrated Sensors
Minseong Kim
DGIST
Feb. 2026 - Current (2026 UGRP)
Research Topic
Development of a Next-Generation HCI System Using 3D-Printed Skin-Integrated Sensors
Hobin Byun
DGIST
Feb. 2026 - Current (2026 UGRP)
Research Topic
Development of a Next-Generation HCI System Using 3D-Printed Skin-Integrated Sensors
Jaewan Kim
DGIST
Feb. 2026 - Current (2026 UGRP)
Research Topic
Development of a Next-Generation HCI System Using 3D-Printed Skin-Integrated Sensors
Seungmin Lee
Semiconductor Engineering, DGIST
Sep. 2026 - Current
Research Topic
Development of a Next-Generation HCI System Using 3D-Printed Skin-Integrated Sensors
Seorim Yang
Semiconductor Engineering, DGIST
Sep. 2026 - Current